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Seven disciplines, one silicon signoff.

From microarchitecture through GDS delivery, our teams cover the complete ASIC and SoC implementation flow — engaged individually or as a fully integrated program.

Every stage, one accountable team.

From microarchitecture to GDS delivery, EdgeSilica engineers plug directly into your flow with signoff-grade tooling and clear ownership at every handoff.

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SVC–01

RTL Design

  • Microarchitecture
  • RTL Coding
  • IP Integration
  • Low Power RTL
  • Lint
  • CDC
  • RDC
SVC–02

Functional Verification

  • UVM Verification
  • Testbench Development
  • Assertion Based Verification
  • Functional Coverage
  • Regression Automation
SVC–03

Physical Design

  • Netlist Preparation
  • Floorplanning
  • Power Planning
  • Placement
  • CTS
  • Routing
  • Physical Optimization
  • ECO
  • Timing Closure
SVC–04

Static Timing Analysis

  • Constraint Development
  • MMMC Analysis
  • Timing Closure
  • ECO Validation
SVC–05

Physical Verification

  • DRC
  • LVS
  • ERC
  • Antenna
  • Density
  • Metal Fill
SVC–06

Design for Test (DFT)

  • Scan Insertion
  • ATPG
  • MBIST
  • LBIST
  • Compression
SVC–07

Tapeout Support

  • Final Signoff
  • Release Management
  • GDS Delivery
FLOW

How a program moves through our teams.

STEP 01

RTL & Verification

Microarchitecture, RTL coding and UVM-based functional verification to a clean, coverage-signed-off netlist.

STEP 02

DFT & Timing

Scan/ATPG insertion alongside constraint development and multi-corner static timing analysis.

STEP 03

Physical Design

Floorplan, power planning, placement, CTS, routing and ECO through timing closure.

STEP 04

Signoff & Tapeout

Physical verification, final signoff, release management and GDS delivery.

Tell us which stage your program is at — we’ll take it from there.

Discuss your project
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